|
Andersen, I., Guven, I., Madenci,
E., Gustaffson, G., “The Necessity of Reexamining Previous Life Prediction Analyses of Solder Joints in Electronic Packages”, IEEE
Trans Comp and Pckgng Tech, vol 23 no 3, Sept 2000, pp 516 – 520.
Attarwala, A.I., Tien, J.K., Masada, G.Y., Dody G., “Confirmation
of Creep and Fatigue Damage in Pb/Sn
Solder Joints”, ASME Jour.
Elect. Packaging, vol 114, June 1992, pp. 109 – 111.
Basaran, C., Finite Element Thermomechanical Analysis of
Electronic Packaging Problems using
Disturbed State Constitutive Models,
Ph.D. Dissertation, Dept. of Civil Eng. and Engineering Mechanics,
University of Arizona, Tucson AZ 85721, 1994.
Barker, D., Vodzak, J., Dasgupta, A., Pecht M., “Combined
Vibrational and Thermal Solder Joint Fatigue – A Generalized Strain
versus Life Approach”, ASME Jour. Elect. Packaging, vol 112, June
1990, pp. 129 – 134.
Bonda and Noyan, “Effect of Specimen Size in Predicting the
Mechanical Properties of PbSn Solder Alloys”, IEEE Trans CPMT – Part
A, v 19 n 2., June 1996, pp. 208 – 212.
Cadek, J.A., Creep in Metallic Materials, Elsevier,
Amsterdam, The Netherlands, 1988.
Caglioti, A., and Milone, A.F., eds., Mechanical and Thermal
Behavior of Engineering Materials, Lecture LXXXII, Proceedings of the
International School of Physics, Italian Physical Society, North Holland
Publishing Company, NY, 1982.
Chan, Y.C., Tu, P.L., So,
A.C.K., Lai, J.K.L., “Effect of Intermetallic Compounds on the Shear
Fatigue of Cu/63Sn-37Pb Solder Joints”, IEEE Trans CPMT – Part B,
v 20 n 4., Nov 1997, pp. 463 – 469.
Chen, J.Y., Optimization in the Disturbed State Concept
Constitutive Modeling and Application in Finite Element Analysis,
Ph.D. Dissertation, Dept. of Civil Eng. and Engineering Mechanics,
University of Arizona, Tucson AZ 85721, 1997.
Chia, J.H., Constitutive Modeling of Thermomechanical Response
of Materials in Semiconductor Devices with Emphasis on Interface
Behavior, Ph.D. Dissertation, Dept. of Civil Eng. and Engineering
Mechanics, University of Arizona, Tucson AZ 85721, 1994.
Choi, S., Bieler, T.R., Lucas, J.P., Subramaniam, K.N.,
“Characterization of the Growth of Intermetallic Interfacial Layers of
Sn-Ag and Sn-Pb Eutectic Solders and Their Composite Solders on Cu
Substrate During Isothermal Long-Term Aging”, Journal of Electronic
Materials, vol 28 no 11, 1999, pp. 1209 – 1215.
Coffin, L.F., “Fatigue at High Temperature”, ASTM STP 520,
PA, 1973.
Conrad, H., Guo, Z., Fahmy,
Y., and Yang, D., “Influence of Microstructure Size on the Plastic
Deformation Kinetics, Fatigue Crack Growth Rate, and Low-Cycle Fatigue
of Solder Joints”, Journal of Electronic Materials, vol 28, No.
9, 1999, pp. 1062 – 1070.
Constable, J.H., and Lizzul, C., “An Investigation of Solder
Joint Fatigue Using Electrical Resistance Spectroscopy”, IEEE Trans.
CPMT – Part A, v 18 n1, March 1995, pp 142 – 152.
Cook, R.D., Malkus, D.S., Plesha, M.E., Concepts and
Applications of Finite Element Analysis, Wiley, 1989.
Cottrell, A.H., Theoretical Structural Metallurgy, 2nd
ed. Edward Arnold (Publishers) Ltd., London, 1957.
Cutiongco, E.C., Vaynman, S., Fine, M.W., Jeonette, D.A.,
“Isothermal Fatigue of 63Sn‑37Pb Solder”, ASME Jour. Elect. Packaging,
vol 112, June 1990, pp. 110 – 114.
Darveaux, R., Banerji, K., “Constitutive Relations for Tin‑Based
Solders”, IEEE Trans. CHMT, v15 no. 6, Dec 1992, pp 1013 – 1024.
Dascher, D., “Measuring Parasitic Capacitance and Inductance
using TDR”, Hewlett – Packard Journal, April 1996.
Dasgupta, A., Oyan, C., Barker, D., Pecht, M., “Solder
Creep-Fatigue Analysis by an Energy Partitioning Approach”, ASME
Jour. Elect. Packaging, vol 114, June 1992, pp. 152 – 159.
Desai, C.S., Chia, J., Kundu, T., Prince,
J.L., 1997, “Thermomechanical response of materials and
interfaces
in electronic packaging: Part I - unified constitutive model and
calibration, ASME Jour. Elect.
Packaging,
119(4), pp 294-300.
Desai, C.S., Private communication suggesting investigation of
dissipated‑work based DSC, 1998.
Desai, C.S., Private communications suggesting use of image
acquisition for solder testing, 1998.
Desai, C. S., Mechanics of Materials and Interfaces: The
Disturbed State Concept, CRC Press, Boca Raton, FL, 2001.
Desai, C.S., Whitenack, R., “Review of Models and the Disturbed State Concept for Thermomechanical
Analysis in Electronic Packaging”, ASME Jour. Elect. Packaging,
vol 123, March 2001, pp. 19 – 33.
Desai, C.S., Wang Z., Dube, M., “New Thermomechanical Device and
Testing Towards Modeling Behavior of Joining Materials, Proc. IPAC’01
The Pacific Rim/ASME International Electronic Packaging Technical
Conference and Exhibition, July 8-13,2001, Kauai, Hawaii, USA.
Desai, C.S., Private communication regarding development of
approximate procedure for curved ultimate envelope, 2002.
Dieter, G.E., Mechanical Metallurgy, McGraw Hill Inc.,
1961.
Dishongh, T.J., The Disturbed State Concept for Material and
Interfaces with Applications in Electronic Packaging, Ph.D.
Dissertation, Dept. of Civil Eng. and Engineering Mechanics, University
of Arizona, Tucson AZ 85721, 1997.
Dowling, N.E., Mechanical Behavior of Materials, Prentice
Hall, Englewood Cliffs, New Jersey, 1993.
Dube, M., “Implications of Cannot Duplicate”, MFPT Conference,
Virginia Beach, VA, March 30 – April 13, 1998.
Dube, M., and Sahay, C., “Uniform
Entry Flow at Low Reynolds Numbers”, ASME Intl. Mech. Eng. Conf and
Exp, Atlanta, GA, Nov 17-22, 1996.
Ericksen, J.L., Introduction to the Thermodynamics of Solids,
Rev. Ed., Springer – Verlag NY Inc., NY, 1998.
Engelmaier, W., “Functional Cycles and Surface Mounting
Attachment Reliability”, ISHM Technical Monograph Series 6984 – 002,
ISHM, Silver Spring, MD, Oct. 1984, pp. 87 – 114.
Feynman, R.P., Leighton, R.B., Sands, M.L., The Feynman Lectures
on Physics, vII, Addison-Wesley, Redwood City CA, 1989
Frear, D.R., Sorensen, N.R., Martens, J.S., “Test Methodologies
to Perform Valid Accelerated Thermomechanical Fatigue Tests of Solder
Joints”, Fatigue of Electronic Materials, ASTM STP 1153, S.A.
Schroeder and M.R. Mitchell, Eds., ASTM, Philadelphia, PA, 1994, pp. 95
– 109.
Frost, N.E., Marsh, K.J., and Pook, L.P., Metal Fatigue,
Dover Publications Inc., Mineola NY, 1999.
Gittus, J., Creep, Viscoelasticity and Creep Fracture in
Solids, Applied Science Publishers Ltd., London, 1975.
Guo, Y., Woychik, C.G., “Thermal Strain Measurements of Solder Joints in
Second Level Interconnections using Moiré Interferometry”,
ASME Jour. Elect. Packaging,
vol 114, March 1992, pp. 88 – 92.
Guo, Z., Sprecher, A.F.,
Conrad, H., “Plastic Deformation Kinetics of Eutectic Pb-Sn Solder
Joints in Monotonic Loading and Low Cycle Fatigue”, ASME Jour. Elect.
Packaging, vol 114, June 1992, pp. 112 – 117.
Gurson, A.L., “Continuum Theory of Ductile Rupture by Void Nucleation
and Growth”, J. Eng. Mat. Tech., Paper No. 76-Mat-CC, 1977.
Hacke, P.L., Sprecher, A.F., Conrad, H., “Microstructure
Coarsening During Thermo-Mechanical Fatigue of Pb-Sn Solder Joints”,
Journal of Electronic Materials, v 26, n 7, 1997, pp 774 – 782.
Hacke, P.L., Fahmy, Y., Conrad, H., “Phase Coarsening and Crack
Growth Rate during Thermo-Mechanical Cycling of 63Sn37Pb Solder Joints”,
Journal of Electronic Materials, v 27, n 8, 1998, pp 941 – 947.
Hare, E.W., and Stang, R.G., “Stress Relaxation Behavior of
Eutectic Tin-Lead Solder”, Journal of Electronic Materials, v 24,
n 10, 1995, pp 1473 – 1484.
Harper, C.A., ed., Electronic Packaging and Interconnection
Handbook, 3rd ed., McGraw Hill, 2001.
Hill, R., The Mathematical Theory of Plasticity, The
Oxford Engineering Science Series, Clarendon Press, Oxford, U.K., 1950,
reprinted 1998.
Hirsch, P.B., ed., The Physics of Metals 2. Defects,
Cambridge University Press, Cambridge UK, 1975.
Igoshev, V.I., and Kleiman, J.I., “Creep Phenomena in Lead – Free
Solders”, Journal of Electronic Materials, v 29, n 2, 2000, pp
244 – 250.
Jackson, K.A., Private Communication, 2002.
Ju, S.H., Kuskowski, S., Sandor, B.I., and Plesha, M.E. ,
“Creep-fatigue damage analysis of solder joints”, Fatigue of
Electronic Materials, S.A. Schroeder and M.R. Mitchell, Eds., ASTM
Special Technical Publication, n 1153, 1994, p 1-21.
Ju, S.
H., Sandor, B. I., and Plesha, M. E., ‘‘Life Prediction of Solder Joints
by Damage and Fracture Mechanics,’’ ASME Jour. Elect. Packaging.,
vol 118, Dec 1996, pp. 193–200.
Kachanov, L.M., Theory of Creep, Kennedy A.J. (Translator),
National Lending Library, Boston, MA 1958.
Kachanov, L.M., Introduction to Continuum Damage Mechanics,
Martinus Nijhoft Publishers, Dordrecht, The Netherlands, 1986.
Kachanov, L.M., Foundations of the Theory of Plasticity,
North-Holland Publishing Co., 1971.
Kelkar, N, Dasgupta, A.,
Pecht, M., Knowles, I., Hawley, M., Jennings, D., “Smart Electronic
Systems for Condition Based Health Management”, Qual. and Rel. Intl,
v. 12, 1996, pp. 1- 6.
Kennedy, A.J., Processes
of Creep and Fatigue in Metals, Edinburgh, Oliver and Boyd, 1962.
Knecht, S., and Fox, L., “Integrated matrix creep: Application to
accelerated testing and lifetime prediction”, in Solder Joint
Reliability: Theory in Application, J. H. Lau, Ed. New York: Van
Nostrand Reinhold, 1991, ch. 16.
Konetzki, R.A., Zhang, M.X., Sluzewski, D.A., Chang, Y.A.,
“Oxidation of (Pb, Sn) and (Pb, In) Alloys”, ASME Jour. Elect.
Packaging, vol 112, June 1990, pp. 175 – 178.
Kreyszig, E., Advanced Engineering Mathematics, John Wiley
& Sons, NY, 1983.
Lau, J. H., and Pao, Y-H., Solder Joint Reliability of BGA,
CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, 1997.
Lau, J.H., Ed., Solder Joint Reliability: Theory and
Applications, van Nostrand Reinhold, NY, 1991.
Langhaar, H.L., Energy Methods in Applied Mechanics, John
Wiley & Sons Inc., NY, 1961.
Lee, S-M., Stone, D.S., “Deformation and Fracture of Pb‑Sn –
Eutectic Under Tensile and Fatigue Loading”, ASME Jour. Elect.
Packaging, vol 114, June 1992, pp. 118 – 121.
Lee, W.W., Nguyen, L.T., Selvaduray, G.S., “Solder joint fatigue
models: review and applicability to chip scale packages”,
Microelectronics Reliability, 40, 2000, pp. 231 – 244.
Li, H., Private Communication, 2002.
Li, H., 2003, FEM Analysis with DSC Modeling for
Materials in Chip-Substrate Systems,
Ph.D.
Dissertation,
Dept. of Civil Eng. and Eng. Mech., University of Arizona, Tucson, AZ.
Marder, M.P., Condensed Matter Physics, John Wiley, NY,
2000.
Mase, G.E., Theory and Problems of Continuum Mechanics,
Schaum’s Outline Series, Mc. Graw Hill Inc., 1970.
Mei, Z., Morris, J.W., Shine, M.C., “Superplastic Creep of
Eutectic Tin-Lead Solders”, ASME Jour. Elect. Packaging, vol 113,
June 1991, pp. 109 – 113.
Mei, Z., Morris, J.W., “Fatigue Lives on 60/40 Solder Joints Made
with Different Cooling Rates”, ASME Jour. Elect. Packaging, vol
114, June 1992, pp. 104 – 108.
Natishan, M., Dube, M., "Health Monitoring of Electronics Systems",
Proc. Predictive Technology Symp., Alexandria, VA, Nov 6-7, 1997.
Needleman, A., Tvergaard, V., “An Analysis of Ductile Rupture in Notched
Bars”, J. Mech. Phys. Solids, vol. 32, no. 6, Pergamon Press,
1984.
Novacki, W., Thermoelasticity, 2nd ed., Pergamon
Press, Polish Scientific Publishers, Warszawa, 1986.
Oyan,
C., Dasgupta, A., Pecht, M., Barker, D., “Role of Strain – Partitioning
Analysis in Solder Life Prediction”, The International Journal for
Hybrid Microelectronics, vol 14 no 2, June 1991, pp 37 - 47.
Pan, T‑Y., “Thermal Cycling Induced Plastic Deformation in Solder
Joints – Part I: Accumulated Deformation in Surface Mount Joints”,
ASME Jour. Elect. Packaging, vol 113, March 1991, pp. 8 – 15.
Pang, J.H.L., Tan, K.H., Shi, X., Wang, Z., “Thermal Cycling
Aging Effects on Microstructural and Mechanical Properties of a Single
PBGA Solder Joint Specimen”, IEEE Trans. Compts. Packgng. Tech.,
v24 no. 1, March 2001, pp 10 – 16.
Pecht, M., Dube, M., Natishan, M., Williams, R., Banner, J.,
Knowles, I., “Evaluation of Built-in Test”, IEEE Trans Aero. and
Electron. Sys., vol 37, n 1, Jan 2001, pp. 266 – 271.
Pecht, M., and Ramappan, V., “Are Components Still the Major
Problem: A Review of Electronic System and Device Field Failure
Returns”, IEEE Trans. CHMT, v15 no. 6, Dec 1992, pp 1160 – 1164.
Perzyna, P., “Fundamental Problems in Viscoplasticity”,
Advances in Applied Mechanics, v 9, 1966, pp 243 – 377.
Planicka, F., Rehounek, L., Vack, V, Zlabeck, P., Double Leaf
Spring Gauge for the Continuous Measurement of the Diameter Change”,
Experimental Stress Analysis 2001, Tabor, Czech Republic, June 4 – 8,
2001.
Qian, Z., Ren, W., Liu, S., “A Damage Coupling Framework of
Unified Viscoplasticity for the Fatigue of Solder Alloys”, ASME Jour.
Elect. Packaging, vol 121, Sept 1999, pp. 162 – 168.
Rafanelli, A.J., “Ramberg-Osgood Parameters for 63-37 Sn-Pb
Solder”, ASME Jour. Elect. Packaging, vol 114, June 1992, pp. 234
– 238.
Reed, R.P and Clark, A.F., eds., Materials at Low Temperatures,
American Society for Metals, Metals Park, Ohio 44073, 1983.
Rose, J.H., Smith., J.R., Guinea, F., and Ferrante, J.,
“Universal Features of the Equation of State of Metals”, Physical
Review B, The American Physical Society, March 1984, pp. 2963 –
2969.
Ross, R.G., “A Systems Approach to Solder Joint Fatigue in
Spacecraft Electronic Packaging”, ASME Jour. Elect. Packaging,
vol 113, June 1991, pp. 121 – 128.
Shao, C., Implementation of DSC Model for Dynamic Analysis of
Soil-Structure Interaction Problems, Ph.D. Dissertation, Dept. of
Civil Eng. and Engineering Mechanics, University of Arizona, Tucson AZ
85721, 1998.
Shen, Y‑L., Li, W., Fang, H.E., “Phase Structure and Cyclic
Deformation in Eutectic Tin‑Lead Alloy: A numerical analysis”, ASME
Jour. Elect. Packaging, vol 121, March, 2001, pp 74 - 78.
Shi, X.Q., Zhou. W., Pang, H.L.J., Wang, Z.P., “Effect of
Temperature and Strain Rate on the Mechanical Properties of 63Sn/37Pb
Solder Alloy”, ASME Jour. Elect. Packaging, vol 121, Sept, 1999,
pp 179 - 185.
So, A.C.K., Chan, Y.C., Lai, J.K.L., “Reliability Studies of
Surface Mount Solder Joints – Effect of Cu‑Sn Intermetallic Compounds”,
Proc. 45th Electron. Comp. Conf., 1995, pp 1073 – 1080.
Solomon, H.D., “Low Cycle Fatigue of 60/40 Solder – Plastic
Strain Limited vs. Displacement Limited Testing”, Electronic
Packaging: Materials and Processes, ed. J.A. Sartell, ASM.
Solomon, H.D., “Strain‑Life Behavior in 60/40 Solder”, ASME
Jour. of Electr. Packaging, vol 111, June, 1989, pp 75 - 82.
Stephens, J.J., Frear D.R., “Time-dependent deformation behavior
of near-eutectic 60Sn-40Pb solder” Metallurgical and Materials
Transactions A: Physical Metallurgy and Materials Science, v 30
Issue number: n 5, 1999, p 1301-1313.
Stone, D.S., “The Creep-Fatigue Interaction in Solders and Solder
Joints”, ASME Jour. Elect. Packaging, vol 112, June 1990, pp. 100
– 103.
Summers, T.S.E, Morris, J.W, “Isothermal Fatigue Behavior of
Sn‑Pb Solder Joints”, ASME Jour. Electr. Packaging, vol 112,
June, 1990, pp 94 - 99.
Swalin, R.A., Thermodynamics of Solids, 2nd
ed., John Wiley & Sons, NY 1992.
Syed A., Panczak, T., Darveaux, R., Lee, S., Lee, C., Partridge,
J., “Solder Joint Reliability of Chip Array BGA”, Pan Pacific
Microelectronics Symposium, Maui, 1998.
Tien, J.K., Hendrix, B.C., Attarwala, A.J., “Understanding the
Cyclic Mechanical Behavior of Lead/Tin Solder”, ASME Jour. Elect.
Packaging, vol 113, June 1991, pp. 115 – 120.
Tribula, D., Grivas, D., Frear, D.R., Morris, J.W., “Observations
on the Mechanisms of Fatigue in Eutectic Pb-Sn Solder Joints”, ASME
Jour. Elect. Packaging, vol 111, June 1989, pp. 83 – 89.
Tribula, D., Morris, J.W., “Creep in Shear of Experimental Solder
Joints”, ASME Jour. Elect. Packaging, vol 112, June 1990, pp. 88
– 93.
Vaynman, S., Ghosh, G., Fine, M.E., “Effects of Palladium and
Solder Aging on Mechanical and Fatigue Properties of Tin-Lead Eutectic
Solder”, Journal of Electronic Materials, v 27, n 11, 1998, pp.
1223 – 1228.
Vianco, P.T., Burchett, S.N., Neilsen, M.K., Rejent, J.A., Frear,
D.R., “Coarsening of the Sn-Pb Solder Microstructure in Constitutive
Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue”,
Journal of Electronic Materials, v 28, n 11, 1999, pp. 1290 – 1298.
Wang, Z., Disturbed State Constitutive Modeling and Testing of
Solders in Electronic Packaging, Ph.D. Dissertation, Dept. of Civil Eng.
and Engineering Mechanics, University of Arizona, Tucson AZ 85721, 2001.
Wang, Z., Desai, C.S., and Kundu, T., Disturbed State
Constitutive Modeling and Testing of Joining Materials in Electronics
Packaging, Report to NSF, Dept. of Civil Eng. and Eng. Mechanics,
University of Arizona, Tucson, AZ, April 2001.
Wassink, R.J.K., Soldering in
Electronics, 2nd ed., Electrochemical Society, Pennington, NJ, 1989.
Wilcox, J.R., Subrahmanyan, R., Li, C‑Y., “Assembly Stiffness and
Failure Criterion Considerations in Solder Joint Fatigue”, ASME Jour.
Elect. Packaging, vol 112, June 1990, pp. 115 – 122.
Wild, R.N., “Some Fatigue Properties of Solders and Solder
Joints”, INTERNEPCON, Brighton, England, Oct. 1975.
Williams, R., Banner, J., Knowles, I., Dube, M., Natishan, M.,
Pecht, M., “An Investigation of Cannot Duplicate Failures”, Qual.
Reliab. Engng. Int., 14, 1998, pp. 331 – 347.
Wong B., Helling, D.E., “A Mechanistic Model for Solder Joint
Failure Prediction under Thermal Cycling”, ASME Jour. Elect.
Packaging, vol 112, June 1990, pp. 104 – 109.
Yamada, S.E., “A Bonded Joint Analysis for Surface Mount
Components”, ASME Jour. Elect. Packaging, vol 114, March 1992,
pp. 1 – 7.
Yang, W., Messler, R.W., Felton, L.E., “Microstructure Evolution
of Eutectic Sn‑Ag/ Solder Joints, Journal of Electronic Materials,
Vol 23, No 8, 1994 pp 765 – 772.
Yang, W., Felton, L.E., Messler, R.W., “The Effect of Soldering
Process Variables on the Microstructural and Mechanical Properties of
Eutectic Sn – Ag/ Cu Joints, Journal of Electronic Materials, Vol
24, No 10, 1995 pp 1465 – 1472.
Yu. Q., Shiratori, M., “Fatigue – Strength Prediction of
Microelectronics Solder Joints under Thermal Cyclic Loading”, IEEE
Trans CPMT – A, v20 no. 3, Sept. 1997, pp 266 – 273.
Zhang, X., Lee, S-W. R., Pao, Y-H., “A Damage Evolution Model for
Thermal Fatigue Analysis of Solder Joints”, ASME Jour. Elect.
Packaging, vol 122, Sept 2000, pp. 200 – 206.
Zinovev, V.W., Handbook of Thermophysical Properties of Metals at
High Temperatures, Nova Science Publishers Inc., NY, 1996.
Zubelewicz, A., Berriche, R., Keer, L.M., Fine, M.E., “Lifetime
Prediction of Solder Materials”, ASME Jour. Elect. Packaging, vol
111, Sept 1989, pp. 179 – 182.
|